TSMC’s 5-nanometer process responded enthusiastically, and major chip manufacturers frantically gave orders
On October 30, it was reported that TSMC President Wei Zhejia recently mentioned that TSMC’s 5nm process has entered the stage of risk trial production, and has a good yield performance. Coupled with the enthusiastic response from major customers, it is expected to reach a production capacity of 80,000 pieces in the future. At the same time, TSMC’s 5nm process will increase the use of extreme ultraviolet (EUV) mask layers, and will enter mass production in the first half of 2020 according to the original plan.
Wei Zhejia pointed out that compared with the 7-nanometer process currently in mass production, the 5-nanometer chip density can be increased by 80%, and the computing speed can be increased by 20%. Apple’s iPhone 11 series mobile phone A13 processor launched in the second half of this year uses a powerful version of TSMC’s 7-nanometer extreme ultraviolet (EUV) lithography process. It is reported that Apple’s iPhone 12 series next year has entered the design stage, of which A14 processing The device chip has been trial-produced using TSMC’s 5nm process, and Apple has also obtained chip samples for testing at the end of September.
According to the report, according to TSMC’s official website, TSMC’s 5nm process technology is a process option optimized for both mobile applications and high-performance computing applications. It is also the second-generation TSMC process using EUV technology, and has demonstrated excellent optical capabilities and meets expectations. Good wafer yield. The 5nm process is expected to enter the trial production stage in March 2019 and is expected to start mass production in 2020. TSMC said that it is expected to launch a 5nm FinFet enhanced version process technology with improved performance and power consumption one year after the launch of 5nm.
It is worth noting that Synopsys, an American chip interface IP supplier, announced on October 28 that it will cooperate with TSMC and will use TSMC’s 5nm FinFet enhanced version of the process to develop a series of products, allowing TSMC to make new progress in the 5nm process.
In addition, according to previous market news, five major customers such as Apple and Huawei HiSilicon use 5nm as the next-generation main chip process, and TSMC’s 5nm process has also been grabbed by various companies. Since the second half of 2019, TSMC’s 5-nanometer process has also gradually increased its production capacity, from 45,000 to 50,000 pieces per month, to 70,000 pieces, and the latest news is 80,000 pieces.
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