On July 28, 60 foreign-funded projects with a total investment of 5.85 billion US dollars were signed in Shanghai. The WeChat public account “Shanghai Release” pointed out that the key industries of the projects signed this time are widely distributed, involving integrated circuits, biomedicine, artificial intelligence and artificial intelligence. Industry and Electronic information, life and health, automobiles, high-end equipment, advanced materials and other fields.

According to the first financial report, the contracted project includes Nixi semiconductor Technology (Shanghai) Co., Ltd. The report pointed out that Nixi semiconductor Technology (Shanghai) Co., Ltd. is mainly engaged in the product design and manufacturing of power semiconductor devices. The new investment of 60 million US dollars is mainly used for new product research and development, the introduction of advanced production equipment, and the increase of wafer surface convexity. point process, ultra-thin wafer processing, etc., making it meet the increasingly complex application requirements of advanced electronic products.

According to the data, Nixi Semiconductor was established in 2007 with a registered capital of 28.5 million US dollars. It is 100% held by Wanguo Semiconductor (Hong Kong) Co., Ltd., and its headquarters Alpha & Omega Semiconductor, Inc. (AOS) is located in Silicon Valley, USA. The products are mainly used for Consumer electronics (notebooks, mobile phones, digital cameras, etc.).

At present, Nissi Semiconductor is transforming from traditional packaging to high-end advanced packaging, and has set its sights on Bumping wafer-level chip packaging technology, which is an advanced chip packaging technology with low cost, low power consumption and small area. According to Zhou Shuhua, the company’s senior R&D manager, in July this year, the Bumping wafer-level chip packaging technology has matured, and small batch production is expected in the third quarter of this year, which will become the company’s new profit growth point in the future.