Flip-chip COB will be an important point for next-generation display technology

Flip-chip COB will be an important point for next-generation display technology

The world is changing too fast, and we are always being dragged forward. But with change, there can be development. The same is true in the large-screen Display industry. From the beginning of the Display technology such as projectors, LCD, LED, and OLED, a hundred schools of thought contend, to the dominance of small-pitch LEDs, and then to the transition to MINI LEDs, and now the rise of Micro LEDs, LED displays It has experienced a great leap from birth, glory to strength.

The world is changing too fast, and we are always being dragged forward. But with change, there can be development. The same is true in the large-screen display industry. From the beginning of the display technology such as projectors, LCD, LED, and OLED, a hundred schools of thought contend, to the dominance of small-pitch LEDs, and then to the transition to MINI LEDs, and now the rise of Micro LEDs, LED displays It has experienced a great leap from birth, glory to strength.

With the improvement of material level and the rapid development of the Internet, human’s demand for visual experience has become the driving force for the continuous reduction of LED chip size and pixel pitch. There is an urgent need for applications, and it is an inevitable trend for LEDs to develop towards micro-pitch display. Under this trend, Micro LED is considered to be the direction of future development. At the same time, Micro LED will inevitably take the flip-chip COB technology route.

Flip-chip COB will be an important point for next-generation display technology

Prior to this, the impact of the advantages of COB technology on the industry market structure has become the focus. The birth of flip-chip COB has raised COB technology to a new level. Flip-chip COB is an upgraded product of regular-installed COB. On the basis of the advantages of ultra-small dot pitch, high reliability, and non-glare surface light source of regular-installed COB, the reliability is further improved, the production process is simplified, the display effect is better, and the near-screen experience is perfect. It can realize chip-level spacing in the true sense, reaching the level of Micro LED.

Why do you say this way?

Then I have to mention Xida Electronics, the leading company in this sector. In 2016, the COB camp represented by Xida Electronics shook SMD’s position as the leader of the martial arts in LED display packaging for more than ten years, and Xida Electronics In 2017, the invention patent authorization of the wafer-inverted integrated LED display packaging module has been completed, realizing the technical iteration from the front-mounted COB to the flip-chip COB, until the launch of the dot pitch from P0.7-P2 at the 2019 Shanghai International LED Exhibition. 5 The new flip-chip COB product has become the first company in the industry to launch a full range of flip-chip COB products, making LED display a big step forward towards the ultra-high-definition P0.X micro-pitch era. At present, Xida has achieved large-scale production of a full range of flip-chip COB products, with an annual production capacity of 25,000 square meters and an annual output value of 1 billion yuan.

During this period, the Micro LED products released by internationally renowned display manufacturers Samsung and Sony all adopted COB integrated packaging technology, while Cedar Electronics’ flip-chip COB products are display products comparable to those of Sony and Samsung. Competing in the same field, there is no stage fright at all. Entering 2020, Cedar Electronics launched 0.47mm flip-chip cob products, Ledman released P0.6 flip-chip COB, AET 0.7 flip-chip COB settled on CCTV, and Shendecai released D-COB, which fully proved the flip-chip COB Packaging technology is the best choice for ultra-high-density small-pitch displays in the future Micro LED era, and will become a “watershed” to change the pattern of the small-pitch LED display industry.

Therefore, flip-chip COB will be the mainstream of the future market, representing the highest level of the future LED display industry!

Micro LED mainly has two application directions, one is small-size ultra-micro high-precision display, which is used in VR and other markets; the other is super-large-size display, application scenarios include command monitoring, high-end commercial display, home theater, high-end conferences, etc. At present, the development of small-pitch LED displays to micro-pitch displays is an inevitable trend, and flip-chip LED COB is the main path to achieve ultra-high-density micro-pitch displays. At present, the minimum dot pitch that can be achieved by the flip-chip solution is P0.3. If the chip size is smaller and the substrate technology is added, P0.2 and P0.1 can be achieved.

Regardless of price, just talking about the advantages of technology, the most direct benefits of flip-chip COB are:

1. The spacing is smaller. It can be achieved that there is one product every 0.1mm to meet different application needs. In this regard, the 324 8K Micro LED released by Ledman in 2019 has a pixel pitch of 0.9mm, and the new product released this year is 0.6mm pitch, which proves step by step that the pixel pitch is further miniaturized.

2. Larger size. 2K/4k/8K resolution can be freely spliced ​​in unlimited sizes, which can realize ultra-high-definition large-scale display walls ranging from tens of square meters to hundreds of square meters.

3. Wider application. Nowadays, it is mainly used in various command centers, data centers, studio centers, conference centers, commercial centers, home theaters, etc. In the future, with the advancement of new-generation technologies such as 5G, the Internet of Things and artificial intelligence, as well as the accelerated pace of national informatization construction and urban informatization transformation, the commercial display market space will continue to develop. , entertainment media and security fields, the market prospects are very bright.

In the future, display products will continue to develop towards smaller pitches. 4-in-1 and N-in-1 products are just a transitional product leading to smaller dot pitches and realizing ultra-high-density future displays. Only flip-chip COB technology can become a new generation of displays. the final destination.

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